Call for Papers for the Forum AM Science
@rapid.tech 3D 2026 starts on July 10, 2025
The scientific call for papers for rapid.tech 3D 2026 is just around the corner and will be bigger than ever!
Seize the opportunity and submit your paper for review starting July 10, 2025, to secure publication in PIAM and a presentation opportunity at rapid.tech 3D 2026 in Erfurt.
We create more visibility for the AM science community
At rapid.tech 3D 2026, science will receive more space and visibility than ever before. Ensure additional impact with a publication of your successfully reviewed paper in the renowned journals Springer Nature Progress in Additive Manufacturing (PIAM, Springer Natur Verlag) or RTe Journal (free open access publication).
On this page, you will find all the new features and details about our call for papers for rapid.tech 3D 2026.
Schedule
- July 10, 2025: START of paper submissions for rapid.tech 3D 2026 (via the PIAM portal) - The author must assign the submission to the following collection/special issue during the submission process: Advancing Additive Manufacturing: Materials, Processes and Applications Across Industries.
- October 31, 2025: DEADLINE for paper submissions for rapid.tech 3D 2026 (via the PIAM portal) - IMPORTANT: There will be NO extension of the submission period. The stated DEADLINE is BINDING and MUST be adhered to.
- December 17, 2025: Reviewer Feedback: Paper is accepted for PIAM (possibly with additional requirements) OR for RTe Journal (possibly with additional requirements) OR has failed the review.
- January 10, 2026: DEADLINE for submission of revised papers for which reviewers have issued additional requirements.
- January 30, 2026: Announcement of the papers selected for the 2026 conference program.
For the first time, the entire review process will be handled via the online portal of our publishing partner PIAM. The SNAPP tool is used to handle both the paper submission and all other related communication during the review process.
IMPORTANT: The author must assign their submission to the following Collection/Special Issue: Advancing Additive Manufacturing: Materials, Processes and Applications Across Industries. Authors are also asked to include information in the cover letter that the paper belongs to rapid.tech 3D 2026 to facilitate correct review assignment.
The papers will be reviewed double-blind by the reviewers. Subsequently, the accepted contributions will be assigned to the available partner journals, Progress in Additive Manufacturing and RTe Journal, by our Joint Editorial Board.
Contributions assigned to the RTe Journal will receive an official rejection in the SNAPP tool, and the further review process for these papers will then take place outside of the SNAPP tool. The publication channel to which a paper is assigned has no influence on the possibility of presenting it at rapid.tech 3D 2026.
IMPORTANT TO KNOW
English Language
Please note that ONLY English-language contributions will be accepted. If your contribution is also accepted for presentation, the presentation language will also be English.
Conference participation expected
We expect authors who submit a paper through the PIAM call for papers to attend the conference, if the review process is successful, to give a talk or present a poster.
Paper Criteria
To participate in the review process, authors are expected to submit a short communication paper of approximately 4 pages.
>> Please inform yourself in advance about the formal requirements PIAM places on submissions: Submission guidelines | Progress in Additive Manufacturing. <<
24 presentation slots available
The contributions with the highest degree of innovation (according to review ratings) will receive one of the presentation slots in the conference program.
A maximum of 24 presentation slots for scientific contributions are planned in the 2026 congress program.
Alternative: Poster Session
If you do not wish to give a presentation, you can instead prepare your contribution as a DIN A1 poster and present it during the poster session.
Presentation Frameset
A presentation slot lasts a total of 20 minutes and is divided into 15 minutes of presentation time and 5 minutes for questions and moderation.
Participation in Erfurt
Authors presenting a paper or poster in Erfurt will be given the opportunity to participate in the three-day conference.
IMPORTANT: Participants are responsible for all costs for meals and accommodation.
High-caliber review
All submitted papers will be reviewed in a double-blind process by a renowned AM experts of the rapid.tech 3D Scientific Review Committee.
Securing High Distinction Open Access Publication
Please note the following if your work is accepted for publication in PIAM:
Your work can be published either open access (free of charge) or non-open access (for a fee). We recommend open access publication, as it makes your research more visible and accessible immediately after publication. The article processing charge (APC) is usually covered by the DEAL consortium or other national or international agreements. You can check directly on the website whether your institution's APC is covered or not. If your institution's APC is not covered and you are unable to fund the APC, you also have the option of publishing your work non-open access.
How do PIAM and RTe differ in their publication scope?
PIAM publishes scientific papers reporting original and significant research related to established and emerging additive manufacturing (AM) processes and technologies. It serves as a platform for academia and industry. PIAM papers are also listed on Elsevier's scientific platform "Scopus," for example.
RTe Journal is an open-access electronic journal publishing articles in the field of additive and digital manufacturing technology. The goal of RTe Journal is to provide a platform for the publication of applied research with a high degree of practical relevance.
Questions about the 2026 Call for Papers? As always, the organizer of the review process will be happy to assist you:
University of Duisburg-Essen
Academic Council | Chair of Manufacturing Engineering
Dr.-Ing. Stefan Kleszczynski
Tel.: +49 (0)203 - 379 1268
Email: stefan.kleszczynski@uni-due.de